Substrate Material - Company Ranking(15 companies in total)
Last Updated： Aggregation Period:Nov 05, 2025〜Dec 02, 2025
This ranking is based on the number of page views on our site.
Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| At Richang Industrial, we offer glass cloth-based PPE resin (polyphenylene ether) copper-clad laminates as materials for low dielectric cons... | High-speed servers and routers, GPS antennas, downconverters, in-vehicle devices such as ETC, digital broadcasting equipment, semiconductor ... | ||
| 1. High dielectric constant / Dk=11.3 (@1GHz) 2. Low dielectric loss tangent / Df=0.0030 (@1GHz) 3. Good handling with a bending modulus... | - Miniaturization of high-frequency components such as antennas and sensors - Component-integrated substrates | ||
| This is a substrate material for directly mounting semiconductor devices. It is a resin-based substrate material that can withstand the hot ... | Printed circuit board materials for thin film semiconductor package substrates | ||
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利昌工業
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- Featured Products
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Low dielectric constant & low dielectric loss tangent printed circuit board materials
- overview
- At Richang Industrial, we offer glass cloth-based PPE resin (polyphenylene ether) copper-clad laminates as materials for low dielectric cons...
- Application/Performance example
- High-speed servers and routers, GPS antennas, downconverters, in-vehicle devices such as ETC, digital broadcasting equipment, semiconductor ...
High dielectric constant & low dielectric loss tangent printed circuit board materials
- overview
- 1. High dielectric constant / Dk=11.3 (@1GHz) 2. Low dielectric loss tangent / Df=0.0030 (@1GHz) 3. Good handling with a bending modulus...
- Application/Performance example
- - Miniaturization of high-frequency components such as antennas and sensors - Component-integrated substrates
Thin material for printed circuit boards for package substrates
- overview
- This is a substrate material for directly mounting semiconductor devices. It is a resin-based substrate material that can withstand the hot ...
- Application/Performance example
- Printed circuit board materials for thin film semiconductor package substrates
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利昌工業
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